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PCB Assembly: How to optimize the reflow profile?

2017-06-15

According to the recommendation by the IPC association, the generic Pb-free solder reflow profile is shown below. The GREEN area is the acceptable range for the whole reflow process. Does it mean that every spot in this GREEN area should fit your board re

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PCB Assembly: How to Maintain a Reflow Oven?

2017-06-14

Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve PCB Assembly production efficiency and product quality. One of the most important tasks for properly maintaining a reflow oven is remove the built-u

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How to get real-time thermal data for a PCB?

2017-06-13

Althoughthereisathermaldatatestingfunctionforourreflowoven,ShenzhenGrandeElectronic stillusesahigh-end,off-line,KICthermalprofilerasourkeyinstrumentforoptimizingth

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How to Request a PCB Assembly Quote in China?

2017-06-12

Shenzhen Grande Electronic functions with the support of experienced resources and latest technology. So it is not difficult to request a PCB assembly quote from Shenzhen Grande in China. Many buyers contact us and request for circuit board assembly quote

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How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

2017-06-10

The tombstone phenomenon is a defect that occurs when passive SMT components are partially or completely lifted from the PCB pad. What usually occurs is that one end of chip is soldered on the PCB pad while opposite end of the chip stand ups vertically, l

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How to Prevent Solder Joint Voiding and Cold Solder Defects

2017-06-09

Solder joint voiding is a phenomenon that causes empty spaces or voids to occur within the joint. Solder joint voiding often occurs on BGAs and larger pads. Voids are related to flux that’s entrapped in the joint, as well as paste oxidation.

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How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?

2017-06-08

The 3528 PLCC RGB LED*, such as theLG LEMCS32F00AZ01, has ultra high brightness in a compact size. Heat dissipation should be considered during layout design. The traces that connect each LED pad should be designed as wide as possible.

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How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

2017-06-07

A solder ball is the most common type of defect that occurs in the SMT assembly process. Solder balls, which have a diameter are greater than 0.13mm or they are within 0.13mm of traces, violate the minimum electrical clearance principle.

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How to Prevent Short Circuits to Ground in QFN Components?

2017-06-06

In the PCB layout design stage, the designer should consider adding the same size exposed copper pan in the center of QFN land pattern. This offers a heat conduit for thermal relief that makes the components work with more stability.

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How to Prevent Non-Wetting Defect during the SMT Reflow Process

2017-06-05

Wetting issues are classified by Non-wetting and Dewetting. According to the IPC standard, non-wetting is defined as the inability of molten solder to form a metallic bond with the base metal.

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