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Shenzhen Grande Electronic offers Ball Grid Array (BGA) assembly


Shenzhen Grande Electronic Inc. is a renowned EMS provider. It is capable of doing fine pitch assemblies that have less than 0.5 mm pitch. Grande has been doing BGA soldering for a long time and it offers x-ray inspection for BGA soldering.


PCB assembly Ball Grid Array Inspection - Shenzhen Grande Electronic


Ball Grid Array (BGA) assembly is relatively newer, more sophisticated technique which is gradually replacing the Dual-In line-Package technique (DIP) or conventional flat packaging techniques.

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