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An Analysis of SMT Solder Paste Printing Defects

2017-02-28

In SMT PCB production, solder paste printing is a critical step. Since the solder paste is used to directly form the soldering joint, the quality of solder paste printing affects the performance and reliability of the surface mount assembly.

Shenzhen Grande Electronic offers Ball Grid Array (BGA) assembly

2017-02-28

Shenzhen Grande Electronic Inc. is a renowned EMS provider. It is capable of doing fine pitch assemblies that have less than 0.5 mm pitch. Grande has been doing BGA soldering for a long time and it offers x-ray inspection for BGA soldering.

PCB assembly Ball Grid Array Inspection - Shenzhen Grande Electronic

2017-02-28

Ball Grid Array (BGA) assembly is relatively newer, more sophisticated technique which is gradually replacing the Dual-In line-Package technique (DIP) or conventional flat packaging techniques.

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