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Quality Management

Shenzhen Grande Electronic proceed with production in accordance with ISO14001, IS09001,TS16949 and UL certification, all products are complied to RoHS and IPC standard. 

Components Quality control
To make sure the components to be used are good quality, there are several processes that we follow:

1,First  of all , we will do an overview of the visual electronic components. 

If we find any problem, we will replace it at once. When visual distribution inspection is completed, products are escalated to the next level-electronic components engineering distribution inspection for review.

2,Engineering Components Inspection
Our engineers receive the components for evaluation at a microscopic level to ensure quality. Any suspect parts or discrepancies that are discovered in the visual inspection process will either be verified.

3,Solderibility Testing 
The samples undergo an accelerated 'aging' process before being tested for solderibility. We also need take into consideration the natural aging effects of storage prior to board- mounting. In addition, we have a higher level of inspection under the customer request. 

4,X-Ray Inspection for BGA
Our automated X-ray inspection systems can monitor a variety of aspects of PCBA production.  Such as, BGAs, CSPs and FLIP chips. The equimpment help us check  the assembly if done right and  quickly analyze the defects and other information . It can reduce the defects and improve the quality of the products.  It not only can check the actual faults, but also can be altered to reduce the fault levels on the boards. It can help us keep the highest standards in our assembly.

5,AOI inspection for SMT
AOI is a primary testing technique in PCB assembly. And it applies to fast and accurate inspection of errors or defects occurring in PCB assembly process. AOI also can be applied both to bare PCBs and PCB assembly. We mainly apply AOI to inspect surface mount technology assembly line and for testing of bare PCBs.

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