Yep! All IC package dimensions are standard, such as DFN, QFN, QFP, BGA, SOP and so on, which comply with the Standards of JEDEC ( Joint Electron Device Engineering Council, USA.)
PS:
DFN: Dual flat-pack no lead
QFN: Quad flat no-leads package
QFP: Quad flat package
BGA: Ball Grid Array
SOP: Small-outline package
List of integrated circuit packaging types - Wikipedia
