Shenzhen Grande Electronic Linkedin Page
Shenzhen Grande Electronic Co., Ltd logo
E-mail us for a Quote:
Call us now:

Technical Article

PCB Fabrication: Blind and Buried Via Boards

Time:2017-04-08 15:38:57 Click:

PCB Fabrication Blind and/or buried vias are similar to traditional, multi-layer boards with through-holes in that these via create connections between all the layers of the board. But one important difference is that blind and buried vias permit circuits of non-planar topography to be connected, which traditional multi-layer boards can’t do. This is an important difference and advantage since it economizes the use of space on the board by permitting only the required layer be connected. 

Shenzhen Grande applies specific definitions to the various types of drilled interconnections.

 They are:

  ▪ Through-hole via: on that can be accessed from both external layers of the board
  ▪ Blind via: one that doesn’t go through the complete board yet can be accessed by one of the external layers of the board.
  ▪ Buried via: one that only makes connections with the inner layers of the board and is not accessible by any of the external layers
BBV Board with 6 Layers
BBV Board with 6 Layers

Previous:PCB Design: Basics of Control Impedance

Next:Grande Electronic offer circuit board repair and rework services

Request an Official Quote



File Upload

Upload a list of files

    Please upload your Gerber files and BOM. You can upload an unlimited number of files as long as the total size of all files does not exceed 20 MB. To ensure you receive your official quote in less than 24 hours, please include the quantity of circuit boards for which you would like a quote.

    If you require that we sign a Non-Disclosure Agreement (NDA), please send it to us prior to sending your files and we will be happy to accommodate.

    Home About Us Services Quality Pb-Free News Contact Us

    Copyright ® 2017,Shenzhen Grande Electronic Co., Ltd. All Rights Reserved. English 中文站 Sitemap